低介电高耐热丁苯树脂/双马来酰亚胺复合材料制备与研究  

Preparation and Study on Bismaleimide/Styrene Butadiene Resin Composites with Low Dielectric and High Heat Resistance

作　　者：聂婭 金石磊[1,2] 段家真 NIE Ya;JIN Shi-lei;DUAN Jia-zhen(Shanghai Research Institute of Materials,Shanghai 200437;Shanghai Key Laboratory of Engineering Materials Application and Evaluation,Shanghai 200437,China)

机构地区：[1]上海材料研究所,上海200437 [2]上海市工程材料应用与评价重点实验室,上海200437

出　　处：《广州化工》2022年第7期82-84,90,共4页GuangZhou Chemical Industry

摘　　要：采用丁苯树脂(SBR)和N,N′-4,4′-二苯甲烷双马来酰亚胺(BMI)为树脂原料,制备了一种具有低介电常数、高耐热性能的复合材料,研究了BMI添加量对复合材料的介电性能和耐热性能的影响。当BMI添加量为10%时,复合材料的介电常数为3.24,介电损耗正切为4.13×10^(-3)。红外光谱分析(IR)与SEM分析表明,BMI与丁苯树脂发生交联固化反应;DSC和TGA分析表明,复合材料的熔融温度为200℃,初始热分解温度为450℃,质量损失率为50%。Styrene butadiene resin(SBR) and N,N′-4,4′-diphenylmethane bismaleimide(BMI) were used as raw materials to prepare a composite with low dielectric constant and high heat resistance. The effects of BMI content on the dielectric properties and heat resistance of the composites were studied. When BMI content was x, the dielectric constant of the composite was 10%, and the dielectric loss tangent was XX. Infrared spectrum analysis(IR) showed that BMI had crosslinking and curing reaction with styrene butadiene resin, DSC and TGA analysis showed that the glass transition temperature of the composite was 200 ℃, the initial thermal decomposition temperature was 450 ℃, and the residual carbon content was 50%.

关 键 词：双马来酰亚胺树脂 丁苯树脂 低介电 高耐热 

分 类 号：TQ322.4[化学工程—合成树脂塑料工业]