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作 者:樊江磊 王宁格 路全彬 裴夤崟 李莹 王艳 曹阳 王永彪 刘建秀 FAN Jianglei;WANG Ningge;LU Quanbin;PEI Yinyin;LI Ying;WANG Yan;CAO Yang;WANG Yongbiao;LIU Jianxiu(School of Mechanical and Electrical Engineering,Zhengzhou University of Light Industry,Zhengzhou 450002,China;State Key Laboratory of Advanced Brazing Filler Metals and Technology,Zhengzhou Research Institute of Mechanical Engineering,Zhengzhou 450001,China)
机构地区:[1]郑州轻工业大学机电工程学院,郑州450002 [2]郑州机械研究所有限公司新型钎焊材料与技术国家重点实验室,郑州450001
出 处:《有色金属工程》2022年第4期13-19,48,共8页Nonferrous Metals Engineering
基 金:郑州市重大科技创新专项(2019CXZX0065);国家自然科学基金资助项目(U1904175);2018年度河南省高等学校青年骨干教师培养计划项目(2018GGJS090);河南省研究生教育改革与质量提升工程项目(YJS2021AL026)。
摘 要:研究了500℃条件下退火时间对(轧制态)BAg30CuZnSn钎料合金的组织和力学性能的影响。通过对钎料合金进行退火处理,组织观察、力学性能测试等,研究了退火时间对钎料的微观合金组织和力学性能的影响规律。结果表明:随着退火时间的延长,BAg30CuZnSn钎料合金的Cu基固溶体沿着轧制方向由长条状转变为片状且逐渐变得粗大,同时析出网状的Cu-Ag共晶组织,相边界逐渐变得清晰和完整;随着退火时间的延长,钎料合金的显微硬度值(HV_(0.05))呈现出逐渐降低,且在未退火处理时取得最大值120.85,在退火时间为100 h时取得最小值84.5。The effect of annealing time at 500℃on the microstructures and mechanical properties of(rolled)BAg30CuZnSn solder alloy was investigated.The influence of annealing time on the microstructures and mechanical properties of the solder alloy was studied via microstructures observation,mechanical property test,etc.The results showed that as the annealing time increases,the Cu-based solid solution of the BAg30CuZnSn solder alloy changes from elongated to flake,and gradually became coarse along the rolling direction.At the same time,a network of Cu-Ag eutectic structures was precipitated.The boundary gradually became clear and complete.With the increase of the annealing time,the microhardness value of the solder alloy gradually decreased.The maximum HV_(0.05) value of 120.85 was achieved without annealing treatment,and the minimum HV_(0.05) was of 84.5 achieved with 100 h annealing time.
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