E51/DDS/CTBN/POSS-NH_(2)环氧树脂体系固化行为研究  

Study on Curing Behavior of E51/DDS/CTBN/POSS-NH_(2)Epoxy Resin System

作　　者：刘义长 李伟捷 吴凯旋 徐洪耀[1] LIU Yi-chang;LI Wei-jie;WU Kai-xuan;XU Hong-yao(College of Materials Science and Engineering,Donghua University,Shanghai 201620,China)

机构地区：[1]东华大学材料科学与工程学院,上海201620

出　　处：《当代化工》2022年第1期13-17,共5页Contemporary Chemical Industry

基　　金：国家自然科学基金项目(项目编号:20771036)。

摘　　要：采用非等温差示扫描量热法对环氧树脂的固化行为进行研究。配制E51/DDS/CTBN和E51/DDS/CTBN/POSS-NH_(2)环氧树脂体系,通过对其不同升温速率的DSC曲线进行分析得到固化特征温度。通过Kissinger和Ozawa方程计算体系的活化能,得到相关动力学参数。将动力学参数代入n级动力学反应模型,建立反应动力学方程。结果发现,两种树脂体系的固化过程均为复杂的过程。而后利用外推法确定环氧树脂体系的固化工艺条件:90℃/1 h+130℃/2 h+170℃/3 h+200℃/2 h。最后通过红外图谱验证了固化工艺的可行性。The curing process of epoxy resin was studied by non-isothermal differential scanning calorimetry.E51/DDS/CTBN and E51/DDS/CTBN/POSS-NH_(2) epoxy resin systems were prepared. The characteristic curing temperature was obtained by DSC curves of different temperature rising rates. Activation energy of the system was calculated by Kissinger and Ozawa equations, and relevant dynamics parameters were obtained. The kinetic parameters were substituted into the n-order kinetic reaction model,and the kinetic equation was established. It was found that the curing process of the two resin systems was complex. Then the extrapolation method was used to determine the curing process conditions of the system. The curing process was determined as follows:90 ℃/1 h+130 ℃/2 h+170 ℃/3 h+200 ℃/2 h. Finally, the feasibility of curing process was verified by infrared spectrum.

关 键 词：环氧树脂 固化动力学 固化工艺 POSS 

分 类 号：TQ323.5[化学工程—合成树脂塑料工业]