二极管玻璃封装机械裂纹的产生原因和改良措施研究  

Study on the causes and improvement measures of mechanical cracks in diode glass shell packaging

作　　者：张雨林 高成[2] ZHANG Yulin;GAO Cheng(Institute of Mechanical Engineering,Southwest Jiaotong University,Chengdu611756,China;Institute of Reliability and System Engineering,Beihang University,Beijing100191,China)

机构地区：[1]西南交通大学机械工程学院,四川成都611756 [2]北京航空航天大学可靠性与系统工程研究所,北京100191

出　　处：《电子元件与材料》2022年第4期387-391,共5页Electronic Components And Materials

摘　　要：在电子设备中广泛应用的玻封二极管属于机械应力敏感器件,异常的封装烧结工艺或过大的安装应力都可能导致玻壳发生开裂失效。通过对一例玻封二极管玻壳开裂失效的问题进行分析,发现杜美丝表面氧化层裂纹缺陷会导致玻壳烧结界面局部产生较大内应力,烧结后冷却速率过快,就会导致这些较大的内应力无法充分释放,产生残余应力,较大的残余应力会造成玻壳在使用中开裂。最后提出了完善工艺参数的措施。Glass sealed diodes widely used in electronic equipment are mechanical stress sensitive devices.Abnormal packaging and sintering process or excessive stress during installation may lead to glass shell cracking.In this paper,through the analysis of the cracking in glass shell of glass sealed diode,it is found that the cracks on the surface of the Dumet oxide layer lead to great internal stress at the sintering interface of the glass shell.The great internal stress of the glass shell cannot be fully released,because the cooling rate after sintering is too fast,resulting in residual stress in the glass shell.The great residual stress causes the glass shell to crack in use.Finally,the measures to improve the process parameters were put forward.

关 键 词：玻封二极管 杜美丝 封接 开裂 失效分析 

分 类 号：TN31[电子电信—物理电子学]