单颗磨粒干涉划擦过程的材料回弹分析  

Analysis of material elastic recovery during single abrasive interference scratching process

作　　者：翁石光[1] WENG Shi-guang(School of Navigation,Xiamen Ocean Vocational and Technical College,Fujian Xiamen 361012,China)

机构地区：[1]厦门海洋职业技术学院航海学院,福建厦门361012

出　　处：《齐齐哈尔大学学报（自然科学版）》2022年第4期31-36,53,共7页Journal of Qiqihar University(Natural Science Edition)

基　　金：中国交通教育研究会课题(JTYB20-304)。

摘　　要：在实际的磨削加工中,由于被加工材料在加工过程中会发生弹塑性变形,材料在被磨削后会有一定程度的回弹,这一现象会影响磨粒在划擦过程中切削厚度的分布,这便是磨削加工中的材料回弹现象。旨在通过划擦实验研究手段来探究回弹的规律及本质。通过划擦实验分析了划擦过程中的划擦力和力比随划擦深度和压头大小的变化规律,以及材料弹塑性回弹所产生的回弹比随划擦深度和压头大小的变化规律。In the actual grinding process,due to the elastic-plastic deformation of the machined material in the process of grinding,the material will have a certain degree of rebound after grinding,which will affect the distribution of the cutting thickness of the abrasive grain in the process of scratching,which is the elastic recovery phenomenon in grinding process.This paper aims to explore the law and nature of elastic recovery by means of scratch experimental research.The variation law of scratch force and force ratio with scratch depth and indenter head size and the variation law of elastic recovery ratio with scratch depth and indenter head size caused by elastoplastic recovery are analyzed by scratch experiment.

关 键 词：单颗磨粒 划擦 钛合金(Ti-6Al-4V) 材料回弹 

分 类 号：TG580.6[金属学及工艺—金属切削加工及机床]