植物生长用多排阵列LED的散热结构  

Heat Dissipation Structure of Multi-Array LED for Plant Growth

作　　者：彭程 雷允超 毛育青 Peng Cheng;Lei Yunchao;Mao Yuqing(School of Aeronautical Manufacturing Engineering,Nanchang Hangkong University,Nanchang 330063,China)

机构地区：[1]南昌航空大学航空制造工程学院,南昌330063

出　　处：《半导体技术》2022年第4期288-295,331,共9页Semiconductor Technology

基　　金：国家一流专业建设经费资助项目(1180152321100);江西省主要学科学术和技术带头人(青年)项目(20212BCJ23028)。

摘　　要：为了改善植物生长用LED灯具的散热性能,利用Icepak对其散热过程进行仿真。设定LED红、蓝、白组合光芯片数之比为3∶1∶1,研究矩形排列和三角形排列的排列顺序对温度的影响。开展了散热器几何参数对LED芯片温升的影响分析,选择了影响LED芯片结温的四个因素,并进行逐个仿真,确定了LED芯片结温与目标因素参数之间的变化趋势。为了进一步优化散热器主体结构,通过均匀设计法优化组合参数,分析了关于初始散热器基板厚度、翅片间距和翅片厚度这三个重要影响因素对芯片结温的综合作用和影响,对得到的优化组合参数进行仿真。在优化后的方案中,两种阵列的LED结温与初始结构相比分别降低了5.73℃和9.39℃,有效提高了散热性能。In order to improve the heat dissipation performance of LED lamps for plant growth,thermal simulation was accomplished by Icepak.The ratio of the number of LED red-blue-white combination light chips was set as 3∶1∶1,and the effect of the arrangement order of rectangular and triangular arrangements on temperature was studied.The influence of radiator geometric parameters on temperature rise of the LED chip was analyzed,and four factors influencing the junction temperature of the LED chip were selected to be simulated separately.The variation trend between the junction temperature of the LED chip and the target factor parameters was determined.For the purpose of further optimizing the main structure of the radiator,the combined parameters were optimized by the uniform design method.The general effect and influence of three important factors(thickness of the initial radiator substrate,fin spa-cing and fin thickness)on the chip junction temperature were analyzed,and the optimized combination parameters were simulated.In the optimized scheme,the LED junction temperatures of the two arrays are reduced by 5.73℃and 9.39℃respectively compared with the initial structure,which effectively improves the heat dissipation performance.

关 键 词：植物生长用LED 散热器 组合参数 均匀设计 数值仿真 

分 类 号：TN312.8[电子电信—物理电子学]