Influence of Cu content on microstructure,grain orientation and mechanical properties of Sn-xCu lead-free solders  

Cu含量对Sn-xCu无铅焊料显微组织、晶粒取向和力学性能的影响

作　　者：Kannachai KANLAYASIRI Niwat MOOKAM Kannachai KANLAYASIRI;Niwat MOOKAM(Department of Industrial Engineering,School of Engineering,King Mongkut’s Institute of Technology Ladkrabang,Bangkok 10520,Thailand;Department of Industrial and Production Engineering,Faculty of Industry and Technology,Rajamangala University of Technology Rattanakosin Wang Klai Kangwon Campus,Prachuapkhirikhan 77110,Thailand)

机构地区：[1]Department of Industrial Engineering,School of Engineering,King Mongkut’s Institute of Technology Ladkrabang,Bangkok 10520,Thailand [2]Department of Industrial and Production Engineering,Faculty of Industry and Technology,Rajamangala University of Technology Rattanakosin Wang Klai Kangwon Campus,Prachuapkhirikhan 77110,Thailand

出　　处：《Transactions of Nonferrous Metals Society of China》2022年第4期1226-1241,共16页中国有色金属学报（英文版）

基　　金：Rajamangala University of Technology Rattanakosin and School of Engineering,King Mongkut’s Institute of Technology Ladkrabang for the laboratory support of this research。

摘　　要：The effect of Cu content on the microstructure,grain orientation and mechanical properties of Sn-xCu(x=0-4.0 wt.%)lead-free solder was studied.Results showed that added Cu induced the formation of intermetallic phases.Only theη-Cu;Sn;andε-Cu;Sn phases were present in theβ-Sn matrix.For all contents,the strongly preferred orientation of theβ-Sn phase was formed on the{001}plane.In Sn doped with 1.0 wt.%Cu,theη-Cu;Sn;phase exhibited the preferred orientation of{0001}plane,whereas doping with 3.0 or 4.0 wt.%Cu transformed the preferred orientation to the{010}plane.In addition,only the{0001}and{■}planes were present in theε-Cu;Sn phase.The high Cu contents contributed to an increased number of low-angle boundaries,high residual strain,tensile strength and microhardness.研究Cu含量对Sn-xCu(x=0~4.0%,质量分数)无铅钎料显微组织、晶粒取向和力学性能的影响。结果表明,Cu的加入诱导了金属间化合物相的形成。β-Sn基体中仅含有η-Cu;Sn;和ε-Cu;Sn相。对于所有Cu含量的样品,β-Sn相沿{001}面形成强的择优取向。当Sn中掺杂1.0%Cu时,η-Cu;Sn;相具有{0001}面的择优取向,而当掺杂3.0%或4.0%Cu时,择优取向转变为{010}面。此外,ε-Cu;Sn相仅存在{0001}和{■}面。高Cu含量有助于增加低角度晶界的数量,提高残余应变、抗拉强度和显微硬度。

关 键 词：lead-free solder Sn-Cu alloys crystallographic orientation MICROSTRUCTURE INTERMETALLICS mechanical properties 

分 类 号：TG42[金属学及工艺—焊接]