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作 者:Young-Kyun Kim Kee-Ahn Lee
机构地区:[1]Department of Materials Science and Engineering,Inha University,Incheon 22212,Republic of Korea
出 处:《Journal of Materials Science & Technology》2022年第2期264-271,共8页材料科学技术(英文版)
基 金:supported by Korea Institute for Advancement of Technology(KIAT)grant funded by the Korea Government(MOTIE)(P0002007,The Competency Development Program for Industry Specialist)。
摘 要:Cold spray(CS)which has recently become a promising additive manufacturing(AM)technology,was used to fabricate ultra-strong pure copper.In addition,the effects of carrier gas species on the microstructural characteristics,mechanical properties and deformation mechanisms were systemically explored.The CSAM copper manufactured with N_(2) carrier gas reveals a heterogeneous bimodal microstructure consisting of ultra-fine grains at the particle interface and relatively coarse grains in inner particles.With He carrier gas,a homogeneous grain structure consisting of ultra-fine grains in most areas was obtained.Compressive tests showed that N_(2) and He carrier gasses enabled ultra-high yield strengths of 340 and415 MPa,respectively.These values are comparable to severely plastic deformed copper,which has extremely low ductility and shape fidelity.On the other hand,both samples showed a strain-softening phenomenon that does not commonly occur at room temperature.The deformation microstructures revealed that dynamic recovery(DRV)and dynamic recrystallization(DRX)phenomena were generated despite being deformed at room temperature.Based on the above findings,the overall deformation mechanisms according to the carrier gas species in the CSAM copper manufacturing process were discussed.Furthermore,the work hardening and softening behaviors of CSAM Cu are predicted by using a constitutive equation.
关 键 词:Cold spray additive manufacturing Carrier gas Pure Cu Mechanical properties Deformation behavior
分 类 号:TG146.11[一般工业技术—材料科学与工程]
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