一种柔性复合高导热索制备及应用  

Preparation and Application of A Flexible Composite High Thermal Conductivity Cable

作　　者：李春江[1] 马兆昆[2] 余成武[1] 隋杰[1] 付伟纯 张腾飞 孙艳[1] 郑然[1] Li Chunjiang;Ma Zhaokun;Yu Chengwu;Sui jie;Fu Weichun;Zhang Tengfei;Sun Yan;Zheng Ran(Beijing Institute of Control Engineering,Beijing 100190;School of Material Science and Engineering,Beijing University of Chemical Technology,Beijing 100029)

机构地区：[1]北京控制工程研究所,北京100190 [2]北京化工大学材料科学与工程学院,北京100029

出　　处：《航天制造技术》2022年第2期38-41,共4页Aerospace Manufacturing Technology

摘　　要：针对航天器产品内部移动大功率芯片或对结构稳定性要求较高的大功率芯片温升过快、热蓄积的问题,研制了一种柔性复合高导热索,较好地解决了这类大功率芯片的散热问题。给出了柔性复合高导热索的组成,详细描述了柔性导热索的制备方法,介绍了该柔性导热索经历的抗拉测试、柔性试验和导热试验情况。结果表明,该种柔性导热索具有较好的柔性和较高的热导率,可广泛应用于大功率移动芯片和对结构稳定性要求较高的大功率芯片的散热。In view of the problems of moving high-power chips or high-power chips requiring high structural stability inside spacecraft products such as excessive temperature rise and thermal storage,a flexible composite high thermal conductivity cable is proposed to solve the heat dissipation problem of such high-power chips.The composition of the flexible composite high thermal conductivity cable is presented,and the preparation method of the cable is described in detail.The tensile test,flexibility test and thermal conductivity test of the cable are introduced.The results show that the flexible cable has good flexibility and high thermal conductivity,and can be widely used for heat dissipation of moving high-power chips and high-power chips with high structural stability requirements.

关 键 词：轻质 柔性 高导热 导热索 

分 类 号：V19[航空宇航科学与技术—人机与环境工程]