拧紧力矩影响下电子设备鼓包的仿真研究  被引量:2

Simulation Research on the Electronic Equipment Bulge under the Influence of Tightening Torque

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作  者:张理达 文雯[1] 张杰 白振岳[1] 郭建平[1] ZHANG Li-da;WEN Wen;ZHANG Jie;BAI Zhen-yue;GUO Jian-ping(China Aeronautical Computing Technique Research Institute,Xi′an Shaanxi 710068,China)

机构地区:[1]西安航空计算技术研究所,陕西西安710068

出  处:《机械研究与应用》2022年第2期41-42,共2页Mechanical Research & Application

摘  要:针对某电子设备鼓包问题,研究了施加拧紧力矩下鼓包变形的有限元仿真计算方法,计算了不同拧紧力矩下施加给该电子设备等效的螺栓预紧力,建立了某电子设备的计算模型,进行了不同拧紧力矩下变形值的有限元计算分析,测量了某电子设备不同拧紧力矩下的实际变形,证明了该仿真计算方法可靠,对机载电子设备确定拧紧力矩使用值具有重要参考价值。Aiming at the bulging problem of an electronic device,the finite element simulation method of bulging deformation under the application of tightening torque is studied in this paper,and the equivalent bolt pre-tightening force applied to the electronic device under different tightening torques is calculated.A computational model of an electronic device is established,and the finite element calculation and analysis of the deformation value under different tightening torques are conducted.Then the actual deformation of an electronic device under different tightening torques are measured,which proves that the simulation calculation method is reliable and has important reference for determination of the tightening torque value of the airborne electronic equipment.

关 键 词:电子设备 鼓包变形 拧紧力矩 仿真研究 

分 类 号:TM50[电气工程—电器]

 

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