基于Flothem的侧壁风冷机箱结构热仿真  

Thermal Simulation of Side Wall Air-Cooled Rack Structure based on Flothem

作　　者：张杰 郭建平[1] 张理达 文雯[1] ZHANG Jie;GUO Jian-ping;ZHANG Li-da;WEN Wen(AVIC Xi′an Aeronautical Computing Technique Research Institute,Xi′an Shaanxi 710076,China)

机构地区：[1]西安航空计算技术研究所,陕西西安710076

出　　处：《机械研究与应用》2022年第2期49-50,共2页Mechanical Research & Application

摘　　要：随着电子设备热流密度的日益增加,对于电子设备结构设计的散热要求也在逐渐提升,通过三维建模得到侧壁风冷机箱及内部模块的散热结构,随后通过使用Flothem软件对其中的关键部位进行了热仿真分析,得到关键芯片壳温,经数据对比,满足正常工作的散热要求,进而验证了该机箱散热结构设计的合理性。With the increasing heat flow density of electronic equipment,the heat dissipation requirements for the structural design of electronic equipment are gradually increasing.In this paper,the heat dissipation structure of the side wall air-cooled chassis and internal modules are obtained through three-dimensional modeling;and then thermal simulation analysis on the key components are carried out by using the Flothem software to obtain the case temperature of the key chip.After data comparison,the result shows that the heat dissipation requirements of the product normal operation are met,and then the rationality of the heat dissipation structure design of the chassis is verified.

关 键 词：电子设备 侧壁风冷 热仿真 Flotherm软件 

分 类 号：TM20[一般工业技术—材料科学与工程]