小口径火炮弹底压力测试系统抗高过载研究  

Research on anti-high-overload of projectile bottom pressure test system for small caliber gun

作　　者：王宇[1] 裴东兴[1] 张瑜[1] 沈大伟[1] 赵小龙[1] WANG Yu;PEI Dongxing;ZHANG Yu;SHEN Dawei;ZHAO Xiaolong(State Key Laboratory of Dynamic Measurement Technology,North University of China,Taiyuan 030051,China)

机构地区：[1]中北大学省部共建动态测试技术国家重点实验室,山西太原030051

出　　处：《计测技术》2022年第2期85-90,共6页Metrology & Measurement Technology

基　　金：山西省应用基础研究计划项目(201901D111148)。

摘　　要：针对小口径火炮的高过载环境和狭小测试空间可能导致弹底压力测试系统芯片失效,导线以及焊点脱落和断裂的问题,开展弹底压力测试系统抗高过载研究。建立了芯片失效和测试仪器隔离缓冲机理模型,研究了芯片不同安装方向的抗高过载性能,以及不同缓冲材料的抗高过载性能,得出了芯片抗过载能力与安装方向的关系,以及不同缓冲材料的抗过载性能的差异;在此基础上提出了环氧树脂真空灌封方法,解决了测试仪在高过载环境下导线以及焊点脱落和断裂的问题;最后通过实弹测试验证了弹底压力测试系统的存活性和可靠性。研究结果对小口径火炮弹底压力测试系统的设计具有重要意义。In view of the problem that the high overload environment and narrow test space of small caliber gun may lead to the failure of the chip,the shedding and fracture of the wire and solder joints of the projectile bottom pressure test system,the anti-highoverload research of the projectile bottom pressure test system was performed.The chip failure and isolation buffer mechanism model of the tester was established.The anti-high-overload performance of different mounting directions of the chip and different buffer materials were studied.The relationship between the chip's anti-overload capability and the installation direction,and the difference in the anti-overload performance of different buffer materials were obtained.The epoxy resin vacuum sealing method was proposed to solve the problem of shedding and fracture of wire and solder joint in high overload environment.Finally,the survivability and reliability of the projectile bottom pressure test system were verified by live ammunition test.The research results are of great significance to the design of the projectile bottom pressure test system for small caliber gun.

关 键 词：测试 火炮 弹底压力 抗高过载 

分 类 号：TB93[一般工业技术—计量学] TJ306.1[机械工程—测试计量技术及仪器]