Organosolv Lignin for Non-Isocyanate Based Polyurethanes (NIPU) as Wood Adhesive  

作　　者：Jaša Saražin Antonio Pizzi Siham Amirou Detlef Schmiedl MilanŠernek 

机构地区：[1]Biotechnical Faculty,University of Ljubljana,Ljubljana,1000,Slovenia [2]LERMAB-ENSTIB,Universitéde Lorraine,Epinal,88000,France [3]Fraunhofer Institute for Chemical Technology,Pfinztal,76327,Germany

出　　处：《Journal of Renewable Materials》2021年第5期881-907,共27页可再生材料杂志（英文）

基　　金：This research was financed by the ERA-CoBioTech project WooBAdh(Environmentally-friendly bioadhesives from renewable resources).The University of Ljubljana,Biotechnical Faculty was financed by the Slovenian Ministry of Education,Science and Sport and the Slovenian Research Agency within the framework of program P4-0015.The LERMAB was financed by the French Agence Nationale de la Recherche(ANR)as part of the laboratory of excellence(LABEX)ARBRE.

摘　　要：A non-isocyanate-based polyurethane(NIPU)wood adhesive was produced from organosolv lignin,which is a bio-sourced raw material,available in large quantities and produced as a by-product of the paper industry.The formulation of this new lignin-based NIPU adhesive,which is presented,was chemically characterised by Matrix-Assisted Laser Desorption Ionization Time of Flight(MALDI ToF)mass spectrometry and by Fourier Transform Infra-Red(FTIR)spectrometry analyses.The oligomers formed were determined and showed that the three species involved in the NIPU adhesive preparation were formed by the co-reaction of the three reagents used:lignin,dimethyl carbonate,and hexamethylene diamine.Linear and branched structures were both identi-fied.Mechanical properties of the adhesive were determined using the Automated Bonding Evaluation System(ABES)and internal bond(IB)strength test of the laboratory particleboard bonded with it.The adhesive has shown satisfactory mechanical properties after hot pressing at 230℃.Such a temperature is used industrially in the most modern particleboard factories,but since it is hardly feasible for more conventional wood bonding equipment,the reactivity of the NIPU adhesive was successfully increased with the addition of a small percentage of a silane coupling agent.With the addition of the silane,the proposed NIPU adhesive could also be used at a hot-pressing temperature lower than 200℃.

关 键 词：Organosolv lignin NIPU MALDI ToF FTIR ABES 

分 类 号：TQ3[化学工程]