微电阻梁的多物理场仿真研究分析  

Research and analysis of multi physical field simulation of micro-resistance beam

作　　者：杨朵玉 YANG Duoyu(College of Physics Science and Technology,Central China Normal University,Wuhan,Hubei 430070,China)

机构地区：[1]华中师范大学物理科学与技术学院,湖北武汉430070

出　　处：《信息记录材料》2022年第4期26-28,共3页Information Recording Materials

摘　　要：为了探究电子元器件在通电过程中产生的热影响,运用COMSOL Multiphysics软件建立了微电阻梁的三维有限元仿真模型,以此探究导体在通电过程中,导体温度分布情况以及在焦耳热下的变形程度。相比于传统的测温仪器,该模型可以更加简便地得到实验结果,为导体温度的测量提供了一种新方法。In order to explore the thermal influence of electronic components in the electrification process,this study used COMSOL Multiphysics software to establish a THREEIMENSIONAL finite element simulation model of microresistance bea m,so as to explore the conductor temperature distribution and deformation degree under joule heat in the electrification pro cess.Compared with the traditional temperature measuring instrument, this model can obtain the experimental results more easily,and provides a new method for the measurement of conductor temperature.

关 键 词：热影响 COMSOL 微电阻梁 有限元仿真 

分 类 号：TM41[电气工程—电器]