耐热型萘基环氧树脂的固化及性能研究  

Study on curing reaction and performance of heat-resistant naphthyl epoxy resin

作　　者：李伟晨 何俊杰 张发爱[1] LI Wei-chen;HE Jun-jie;ZHANG Fa-ai(College of Materials Science and Engineering,Guilin University of Technology,Guilin 541004,China)

机构地区：[1]桂林理工大学材料科学与工程学院,广西桂林541004

出　　处：《热固性树脂》2022年第2期24-30,共7页Thermosetting Resin

基　　金：国家自然科学基金项目(21664005)。

摘　　要：选用乙二胺(EDA)、异佛尔酮二胺(IPDA)、聚醚胺(PEA)和4,4′-二氨基二苯砜(DDS)四种胺类固化剂与自制耐热型萘基环氧树脂进行固化反应。采用示差扫描量热仪、红外光谱、动态力学分析、热重分析、热膨胀系数(CTE)及力学性能测试对不同体系的固化动力学及固化物性能进行了研究。结果表明,IPDA体系表观活化能最小,刚性最大,弯曲弹性模量比双酚A环氧树脂体系高27.5%。DDS体系的热稳定性最好,初始分解温度比双酚A环氧树脂体系提高16.5℃,玻璃化转变温度(T_(g))达到123.7℃,CTE在T_(g)以下降低62.5%。The four amine curing agents, ethylene diamine(EDA), isophorone diamine(IPDA), polyether amine(PEA) and 4,4′-diaminodiphenylsulfone(DDS) were selected as curing agents to react with self-made heat-resistant naphthalene epoxy resin. The curing kinetics of different systems and the properties of cured products were investigated by differential scanning calorimetry, infrared spectroscopy, dynamic mechanical analysis, thermogravimetric analysis, coefficient of thermal expansion(CTE) and mechanical properties tests. The results showed that the apparent activation energy of the IPDA system was the smallest, the rigidity was the largest, and the flexural modulus of elasticity was 27.5% higher than that of the bisphenol A epoxy resin system. The DDS system had the best thermal stability. The initial decomposition temperature was 16.5 ℃ higher than that of the bisphenol A epoxy resin system. The glass transition temperature(T;)reached 123.7 ℃, and the CTE was decreases by 62.5 % below T;.

关 键 词：萘基环氧树脂 固化剂 固化动力学 异佛尔酮二胺 4 4′-二氨基二苯砜 弯曲弹性模量 热稳定性 

分 类 号：TQ433[化学工程] TQ323.5