车载上架设备CPU风冷散热设计和数值模拟分析  

Design and Numerical Simulation Analysis of CPU Air Cooling Heat Dissipation for Vehicle Mounted Equipment

作　　者：熊仕鹏 刘磊 杨睿 周成果 孔冬冬 XIONG Shipeng;LIU Lei;YANG Rui;ZHOU Chengguo;KONG Dongdong(CETC Rongwei Electronic Technology Co.,Ltd.,Chengdu 610000)

机构地区：[1]中电科蓉威电子技术有限公司,成都610000

出　　处：《现代制造技术与装备》2022年第2期52-55,共4页Modern Manufacturing Technology and Equipment

摘　　要：随着现代工业对电子设备高性能、小型化和抗恶劣环境适应性的要求不断提高,人们对机箱的散热性能也提出了更高的要求。基于此,针对国产高性能中央处理器(Central Processing Unit,CPU)腾云S2500芯片,以GJB 322A车载加固型计算机温度50℃作为环境温度,分析其在1U和2U高度标准上架机箱中的散热设计,同时采用各元器件实际工程数据,通过热仿真软件开展数值模拟,提出了S2500芯片的风冷散热解决方案。With the development requirements of modern industry for electronic equipment with high performance,miniaturization and adaptability to harsh environment, the heat dissipation performance of the chassis is also put forward higher requirements. This paper focuses on the domestic high-performance server Central Processing Unit(CPU) Tengyun S2500 chip,takes the GJB 322 A hardened computer temperature of 50 ℃ as the environment temperature, analyzes its heat dissipation design in the 1 U and 2 U height standard shelf case, adopts the actual engineering data of components, and carries out numerical simulation through thermal simulation software. The solution of air cooling for S2500 chip is proposed.

关 键 词：1U和2U标准上架机箱 腾云S2500 加固计算机 散热器 车载环境 

分 类 号：U463.6[机械工程—车辆工程]