有机硅改性环氧树脂薄膜封装材料的制备及性能研究  

Preparation and Performance of Organic Silicon Modified Epoxy Resin of Film Encapsulation Materials

作　　者：吉静茹 许智鹏 强军锋[2] 刘育红[1] JI Jingru;XU Zhipeng;QIANG Junfeng;LIU Yuhong(School of Chemical Engineering and Technology,Xi’an Jiaotong University,Xi’an 710049,China;College of Materials Science and Engineering,Xi’an University of Science and Technology,Xi’an 710054,China)

机构地区：[1]西安交通大学化学工程与技术学院,西安710049 [2]西安科技大学材料科学与工程学院,西安710054

出　　处：《材料导报》2022年第11期236-244,共9页Materials Reports

摘　　要：本工作通过硅氢加成反应,合成了一种符合柔性薄膜封装工艺的环氧基有机硅树脂(SER)。在此基础上,对不同组成的SER/EP固化薄膜的动态热机械性能、力学性能、亲疏水性、热膨胀系数(CTE)以及热性能进行了系统分析。结果表明,当SER的添加量为10%(为占环氧树脂(EP)的质量分数)时,固化薄膜的拉伸强度为47.11 MPa,相较于单一的EP体系增加了17.8%;当SER的添加量增加至25%时,固化膜的T_(g)逐渐降低,交联密度由2.26 mol·m^(-3)降低至0.8 mol·m^(-3)。此外,SER/EP固化薄膜的柔韧性可达1 mm,通过SEM微观形貌表征也观察到较为明显的韧性断裂特征;同时该固化薄膜的疏水性增强,其接触角相比单一的EP固化膜增加了32.1°。当SER添加量为30%时,SER/EP固化薄膜具有较低的CTE_(1)(8×10^(-6)/℃)(25℃<T<50℃,T<T_(g)),CTE_(2)降低至12.78×10^(-6)/℃(70℃<T<150℃,T>T_(g))。最后,通过喷墨打印封装工艺进一步验证了SER/EP胶液在薄膜封装领域的可使用性。In this work,an epoxy-based silicone resin(SER)conforming to the flexible thin-film encapsulation process was synthesized through the hydrosilylation reaction.On this basis,the dynamic thermomechanical properties,mechanical properties,hydrophobicity,coefficient of thermal expansion(CTE)and thermal properties of SER/EP cured films with different compositions were systematically analyzed.The results show that when the addition of SER is 10%(mass fraction of epoxy resin(EP)mass),the tensile strength of the cured film gets 47.11 MPa,which increases by 17.8%compared with that of pure EP;when the addition of SER increases to 25%,T_(g) gradually decreases,with the crosslink density decreasing from 2.26 mol·m^(-3) to 0.8 mol·m^(-3).The flexibility of the SER/EP cured film can reach 1 mm,and obvious ductile fracture characteristics are also observed by SEM micromorphology characterization.The hydrophobicity of the SER/EP cured film is enhanced,and thus the contact angle increased by 32.1°.Especially,when the addition of SER is 30%,the SER/EP cured film has a lower CTE_(1)(8×10^(-6)/℃)(25℃<T<50℃,T<T_(g)),and CTE_(2) decreases to 12.78×10^(-6)/℃(70℃<T<150℃,T>T_(g)).Finally,the availability of SER/EP adhesive solution in the film encapsulation field was further verified through the inkjet printing.

关 键 词：薄膜封装 环氧树脂 环氧基有机硅树脂 柔韧性 热膨胀系数 喷墨打印 

分 类 号：TQ317.3[化学工程—高聚物工业]