金属互联中晶粒结构梯度演化及其对力、电性能的影响  

Evolution of gradient structures and its effect on themechanical and electrical properties of metal interconnections

作　　者：张恒嘉 张晓敏[1,2] 赵志鹏 唐洪武 ZHANG Hengjia;ZHANG Xiaomin;ZHAO Zhipeng;TANG Hongwu(College of Aerospace Engineering,Chongqing University,Chongqing 400044,China;Chongqing Key Laboratory of Heterogeneous Material Mechanics,Chongqing University,Chongqing 400044,China)

机构地区：[1]重庆大学航空航天学院,重庆400044 [2]重庆大学非均质材料力学重庆市重点实验室,重庆400044

出　　处：《电子元件与材料》2022年第5期495-501,共7页Electronic Components And Materials

基　　金：国家自然科学基金面上项目(11872130);重庆市自然科学基金面上项目(cstc2019jcyj-msxmX0084)。

摘　　要：为了揭示金属互联结构在高电流密度下的晶粒尺寸梯度化对其力学与电学性能的潜在影响,采用考虑了电迁移效应的相场模型研究了电流密度梯度诱导的晶粒尺寸的梯度化路径,通过基于晶粒尺寸与位错密度的本构模型和Matthiessen准则对梯度结构的力学性能和导电性分别进行了定量表征。计算结果表明,梯度结构中细化的晶粒层有助于提高材料整体的强度,而粗晶层保证了良好的延展性,但过多的细晶层引起的晶界密度的提高会造成导电性的损失。The potential effects of the grain size gradient structure on the mechanical and electrical properties of metal interconnects under high current densities were studied.The gradient evolution path of grain size induced by the current density gradient was revealed based on a phase field model which considered the effect of electromigration.Then,the mechanical and electrical properties of the gradient structure were characterized by a generalized constitutive model and Matthiessen criterion,respectively.The calculation results show that the fine-grained layer of the gradient structure contributes mainly to the strength while the coarse-grained layer contributes mainly to the ductility,but too many fine layers will cause a loss of the conductivity.

关 键 词：晶粒尺寸梯度 相场模型 电流密度 强度 导电性 

分 类 号：TN602[电子电信—电路与系统]