金属化薄膜电容器自动锡焊及视觉检测技术研究  

Research on Automatic Soldering and Visual Inspection Technology of Metallized Film Capacitor

作　　者：孙檀 徐刚 张萍 徐元杰 张伟 SUN Tan;XU Gang;ZHANG Ping;XU Yuanjie;ZHANG Wei(Ningbo Jiangbei Gofront Herong Electric Co.,Ltd.,Zhejiang Ningbo 315033,China)

机构地区：[1]宁波市江北九方和荣电气有限公司,浙江宁波315033

出　　处：《电力电容器与无功补偿》2022年第3期48-51,共4页Power Capacitor & Reactive Power Compensation

摘　　要：为了实现金属化薄膜电容器自动锡焊,首先进行元件摆放工装设计,运用视觉定位系统,对需要锡焊的位置进行准确定位;配合自动锡焊系统及锡焊工艺参数的控制,实现焊点的自动焊接;最后采用视觉检测系统对焊点的位置、尺寸、缺陷等参数进行检测与判定,通过拉脱试验测试锡焊点的拉力值检测焊接强度。研究结果表明,本系统可以实现金属化薄膜电容器的自动锡焊与焊点质量检测,能够满足焊点质量要求,焊点一致性与稳定性较好。In order to achieve the automatic soldering of metallized film capacitor,the design of element placement tool is performed firstly.The position needing soldering is accurately positioned by using the visual position system and the automatic soldering of the soldering joint is achieved by the automatic soldering system together with the control of the soldering process parameters.Finally,the visual inspection system is used to automatically detect and determine such parameters as the position,size and defect of the soldering joint.The tensile value of the soldering joint is tested by the tensile test to detect the soldering strength.The research result shows that the system can achieve automatic soldering and quality inspection of the metallized film capacitor,can meet the quality requirement of soldering join and the consistency and stability of the soldering joint is good.

关 键 词：金属化薄膜电容器 自动锡焊 视觉 检测 

分 类 号：TM53[电气工程—电器] TP391.41[自动化与计算机技术—计算机应用技术]