锡铅钎料力学性能及本构模型综述  

Review of Mechanical Properties and Constitutive Model of Tin-Lead Solder

作　　者：邢睿思 王龙[1] 侯传涛[1] XING Rui-si;WANG Long;HOU Chuan-tao(Science and Technology on Reliability and Environmental Engineering Laboratory,Beijing Institute of Structure and Environment Engineering,Beijing 100076,China)

机构地区：[1]北京强度环境研究所可靠性与环境工程技术重点实验室,北京100076

出　　处：《强度与环境》2022年第2期15-27,共13页Structure & Environment Engineering

基　　金：科技部国家重点研发计划(2021YFB3801700);重点实验室基金(6142911180512)。

摘　　要：锡铅钎料广泛用于航天仪器设备封装结构中,而随着仪器设备向功能多样化和体积小型化发展,仪器设备服役功率更大、温度更高。为了实现封装结构精细化设计,提升仪器设备可靠性与耐久性,需要研究锡铅钎料本构关系,准确模拟其力学行为。本文梳理了锡铅钎料力学性能相关试验研究成果,分析锡铅钎料塑性变形特征。针对宏观唯象本构模型,回顾了国内外相关研究结果,总结了模型特征和适用范围,评价了不同模型对锡铅钎料力学性能的预测效果,为不同载荷环境下本构模型选取提供支撑。Tin-lead solders have been widely used in the package structure of aerospace instruments.With the miniaturization of volume and functional diversification of aerospace instruments,the instruments service in higher temperature and power.In order to satisfy the precise design requirements and improve the reliability and durability of the package structures,the constitutive model of tin-lead solders should be investigated.In this paper,a review was presented on the mechanical properties and macro phenomenal constitutive models of tin-lead solders.Different constitutive models were summarized and discussed in details,which was beneficial for model selection.

关 键 词：锡铅钎料 力学性能 率相关 本构模型 

分 类 号：V417.4[航空宇航科学与技术—航空宇航推进理论与工程]