氩离子溅射锡氧化物及焊料合金的光电子能谱探究  

X-ray photoelectron spectroscopy investigation of argon ion sputtered tin oxides and solder alloy

作　　者：胡俊涛 赵明陆 杨士玉 蔡珊珊 刘晨 符泽卫 HU Juntao;ZHAO Minglu;YANG Shiyu;CAI Shanshan;LIU Chen;FU Zewei(Research and Development Center,Yunnan Tin Group(Holding)Co.,Ltd.,Kunming 650101,China;Yunnan Tin Industry Tin Material Co.,Ltd.,Kunming 650217,China)

机构地区：[1]云南锡业集团(控股)有限责任公司研发中心,云南昆明650101 [2]云南锡业锡材有限公司,云南昆明650217

出　　处：《冶金分析》2022年第5期21-28,共8页Metallurgical Analysis

基　　金：云南省重大科技专项(202002AB080001-2);云南省“万人计划”产业技术领军人才专项(YNWR-CYJS-2017-056);云南锡业集团(控股)有限责任公司研发基金(YT-YF-2020-12)。

摘　　要：利用X射线光电子能谱(XPS)及深度剖析技术,定量研究了SnO和SnO_(2)在不同氩离子束能下化学损伤。0.5、1、2 keV的离子束能溅射后,SnO_(2)无明显化学损伤;而SnO则出现不同程度的还原,分别产生了7.0%、15.3%、20.6%的Sn单质。实验还表明,同离子束能不同电流下,Sn^(2+)还原程度相差无几。因而利用XPS及深度剖析技术对Sn焊料进行表面分析时,须选用尽可能低的束能以减少化学损伤。定性讨论了Sn价带,4d和3d电子层的图谱特征,并确定了用Sn 3d5图谱进行Sn价态的定量分析。利用获得的Sn^(0)、Sn^(2+)、Sn^(4+)图谱参数,以模拟波峰焊的锡铜焊料为例,定量分析了Sn价态随深度的变化,结果表明,氧化层最表面主要为SnO_(2)并逐步过渡到SnO。The chemical damages of stannic oxide(SnO_(2))and stannous(SnO)oxide under various argon ion bombardment beam energies were quantitatively investigated by X-ray photoelectron spectroscopy(XPS)combined with the depth profile technique.After sputtered using the ion beam energies of 0.5,1 and 2 keV,no obvious chemical damages on SnO_(2) were observed.However,SnO was reduced in varying degrees,and 7.0%,15.3%,and 20.6%of elemental Sn were generated,respectively.The results also indicated that the reduction degree of Sn^(2+)was almost same at fixed ion beam energy but different current.Therefore,it would be better to use the lowest available beam energy to limit the chemical damage when profiling the tin oxide surface by XPS and depth profile technique.The spectra of Sn valence band,4d and 3d core levels were also qualitatively discussed.The selection of Sn 3d5 spectrum for qualitative analysis of Sn valence was determined.The obtained spectral parameters of Sn0,Sn^(2+)and Sn^(4+)were used to quantitatively analyze the variation of Sn valence with the depth using the simulated wave-soldering tin-copper solder as an example.The results showed that the outmost surface was primarily dominated by SnO_(2),and then altered to SnO gradually.

关 键 词：X射线光电子能谱(XPS) 深度剖析 氩离子溅射 锡氧化物 焊料合金 

分 类 号：O657.62[理学—分析化学] TF814[理学—化学]