不同电镀设备对印制板外层高速差分线插入损耗的影响  

The effect of different electroplating apparatuses on the insert loss of high-speed differential pairs in the outer layer of PCBs

作　　者：韩雪川 李锴 李一峰 Han Xuechuan;Li Kai;Li Yifeng

机构地区：[1]深南电路股份有限公司PCB事业部产品研发部,广东深圳518117

出　　处：《印制电路信息》2022年第5期14-19,共6页Printed Circuit Information

摘　　要：为研究不同电镀设备对印制电路板(PCB)外层高速差分线插入损耗的影响,基于脉冲龙门电镀、直流垂直连续电镀和脉冲垂直连续电镀制作了三组不同的PCB样品。先对不同样品的表面铜箔进行了粗糙度测试和形貌表征,最后对样品表层的差分线进行了插入损耗测试。测试结果表明,脉冲垂直连续电镀设备由于同时具备较好的药水循环特点和脉冲电流,制备的表面铜箔具有较小的粗糙度和致密度较高的锥状形貌,可以改善PCB外层差分线的插入损耗。In order to study the effect of different electroplating apparatuses on the insertion loss of highspeed differential pairs on the outer layer of PCBs,three different groups of PCB samples were prepared based on pulse gantry electroplating,DC VCP electroplating and pulse VCP electroplating,respectively.First,the surface roughness and morphology of copper foil on different samples were characterized,and finally the insertion loss of samples were measured.The result shows that the surface copper foil prepared by pulse VCP plating process tends to have a small surface roughness and a morphology with high density cone because of its good medicine circulation and pulse current.Therefore,the pulse VCP plating process can improve the insert loss of high-speed differential pairs in the out layer of PCB.

关 键 词：信号完整性 插入损耗 电镀设备 铜箔粗糙度 

分 类 号：TN41[电子电信—微电子学与固体电子学]