基于正交实验的用于LCM的单面挠性印制板翘曲研究  

Study on warpage of single sided FPCB for LCM based on orthogonal experiment pan zifeng

作　　者：潘自锋 王港生 杨立发 张亚琳 詹世景 Pan Zifeng;Wang Gangsheng;Yang Lifa;Zhang Yalin;Zhan Shijing(Zhuhai China Eagle Topsun Electronic Technology Co.,Ltd.Zhuhai,Guangdong,519060;Beijing Institute of Technology,Beijing,100081;Zhuhai,Beijing Institute of Technology,Zhuhai,Guangdong,519088)

机构地区：[1]珠海中京元盛电子科技有限公司,广东珠海519060 [2]北京理工大学,北京100081 [3]北京理工大学珠海学院,广东珠海519088

出　　处：《印制电路信息》2022年第4期26-29,共4页Printed Circuit Information

摘　　要：用于LCD显示模块的单面挠性电路板(FPCB)有翘曲度要求。本文以控制翘曲不良为目标,从基材厚度、溢胶量、压合叠构等方面优化工艺参数,研究解决该系列产品翘曲问题的方法。根据正交实验结果可知,影响因素的重要度排序为溢胶量、压合叠构、基材PI厚度,得出最优方案。量产后,该系列产品的合格率得到大幅提升,总体超过98%。本研究也对其它产品的生产起到了借鉴作用。The single sided Flexible Printed Circuit Board(FPCB)for LCD display module has warping degree requirements.This paper aims to control warpage.The process parameters were optimized from the aspects of substrate thickness,glue overflow and lamination structure,and the methods to solve the warpage problem of the product were studied.According to the results of the orthogonal experiments,the factors of influence are the amount of glue spill,lamination stacking and PI thickness in order of importance,and the optimal scheme is obtained.After mass production,the qualification rate of the series has been significantly improved,which exceeds 98%.This study also serves as a reference for production of other products.

关 键 词：单面挠性板 翘曲 溢胶量 压合叠构 正交实验 

分 类 号：TN41[电子电信—微电子学与固体电子学]