聚苯乙烯/木粉保温泡沫材料的制备及其性能研究  

Preparation and Properties of Polystyrene/Wood Flour Thermal Insulation Foam Composites

作　　者：佟敏 史昌明 陈忠源 党乐 刘慧 TONG Min;SHI Chang-ming;CHEN Zhong-yuan;DANG Le;LIU Hui(Electric Power Research Institute of State Grid East Inner Mongolia Electric Power Co.,Ltd.,Huhhot 010020,China)

机构地区：[1]国网内蒙古东部电力有限公司电力科学研究院,内蒙古呼和浩特010020

出　　处：《塑料科技》2022年第4期23-27,共5页Plastics Science and Technology

基　　金：国家电网公司总部科技项目(5400-202031205A-0-0-00)。

摘　　要：利用硅烷偶联剂对木粉进行改性,并将改性木粉与聚苯乙烯(PS)复合,通过自由挤出发泡成型工艺制备木粉增强PS发泡材料。研究木粉填充量对PS材料的发泡效果、回弹性能、保温性能和阻燃性能的影响。结果表明:通过傅里叶红外测试验证木粉改性成功。木粉的含量影响PS材料内部的泡孔结构,从而影响复合材料的性能。木粉填充量为20份时,复合材料具有较好的回弹性,达到95.10%,相对拉伸强度达到19.03 MPa/(g·cm^(-3))。加入20份木粉填充量的复合材料的热导率最低,为0.0392 W/(m·K),具有较好的隔热性能。当木粉填充量为20份,复合材料的LOI值达到35.8%,具有优异的阻燃性能。The wood flour was modified by silane coupling agent,and modified wood flour was combined with polystyrene(PS)to prepare wood flour reinforced PS foam material through free extrusion foaming process.The effects of wood flour filling amount on foaming effect,resilience,thermal insulation and flame retardancy of PS materials were studied.The results show that wood flour is successfully modified by Fourier infrared test.The content of wood flour affects the pore structure of PS materials,thus affecting the properties of composites.When wood flour content is 20 phr,the composite has good resilience,that is 95.10%,and the relative tensile strength reaches 19.03 MPa/(g·cm~3).The composite with 20 phr wood flour has the lowest thermal conductivity of 0.0392 W/(m·K).When the wood flour content is 20 phr,the LOI value of the composite reaches 35.8%,which has excellent flame retardancy.

关 键 词：聚苯乙烯 木塑材料 硅烷偶联剂 保温性能 力学性能 

分 类 号：TB332[一般工业技术—材料科学与工程]