硅MEMS光纤法珀振动传感器的温度解耦分析  

Temperature decoupling analysis of silicon MEMS optical fiber F-P vibration sensor

作　　者：钱江 秦丽[1] 贾平岗[1] 任乾钰 刘华 熊继军[1] QIAN Jiang;QIN Li;JIA Pinggang;REN Qianyu;LIU Hua;XIONG Jijun(Key Laboratory of Instrumentation Science and Dynamic Measurement,Ministry of Education,North University of China,Taiyuan 030051,China)

机构地区：[1]中北大学仪器科学与动态测试教育部重点实验室,山西太原030051

出　　处：《传感器与微系统》2022年第6期29-32,36,共5页Transducer and Microsystem Technologies

基　　金：国家自然科学基金资助项目(52075505);国家科技重大专项项目(J2019V-0015-0110)。

摘　　要：提出了一种应用于400℃环境下的硅微机电系统(MEMS)光纤法珀(F-P)高温振动传感器,并对该传感器进行了温度解耦分析和实验验证。通过MATLAB软件对传感器的法珀干涉光谱进行计算分析,利用MEMS技术设计并加工了传感器及温度集成单元,根据该温度集成单元设计了温度解耦算法。实验结果表明:传感器能在2~22 g_(n),20~400℃环境下工作,设计的温度解耦方法将振动测量误差降低到1.3167%。传感器及其温度解耦分析为高温振动测量领域提供了技术参考。A silicon MEMS fiber-optic Fábry-Pérot(F-P)vibration sensor,which can work at 400℃is proposed,and the temperature decoupling analysis and experimental verification of the sensor are carried out.MATLAB is used to compute and analyze on F-P interference spectroscopy of the sensor,and MEMS fabrication is designed to process the sensor and the temperature integration unit.The temperature decoupling algorithm is also designed.The results show that the sensor can work under the environment of 2~22 g_(n),20~400℃,and the temperature decoupling algorithm reduces vibration measurement errors to 1.3167%.The sensor and its temperature decoupling analysis provide a technical reference for the field of high temperature vibration measurement.

关 键 词：法珀干涉 振动传感器 高温 温度集成单元 温度解耦算法 

分 类 号：TP212[自动化与计算机技术—检测技术与自动化装置]