电磁屏蔽用导电硅胶的固化动力学研究  

Study on Curing Kinetics of Conductive Silicone Adhesive for Electromagnetic Shielding

作　　者：许宝中 张凯 熊岩松 李星辉 单雨馨 杨明山[1] XU Bao-zhong;ZHANG Kai;XIONG Yan-song;LI Xing-hui;SHAN Yu-xin;YANG Ming-shan(School of New Materials and Chemical Engineering,Beijing Institute of Petrochemical Technology,Beijing Key Laboratory of Special Elastomer Composites,Beijing 102617,China;Beijing Day-Pro Technology Co.,Ltd,Beijing 100071,China)

机构地区：[1]北京石油化工学院新材料与化工学院,特种弹性体复合材料北京市重点实验室,北京102617 [2]北京德普诺科技有限公司,北京100071

出　　处：《合成材料老化与应用》2022年第3期20-22,共3页Synthetic Materials Aging and Application

摘　　要：为导电胶的应用工艺提供基础,有必要研究导电胶的固化行为。本文采用动态热机械性能测试法(DMA法),针对不同配比的有机硅导电胶进行了非等温固化特性考察,主要针对储能模量变化曲线,利用Kissinger方程、Crane方程和Ozawa方程分别计算出了有机硅导电胶的固化活化能、反应级数等固化反应动力学参数,为电磁屏蔽用导电硅胶的制备和应用提供了基础数据。In order to provide the basis for the application process of conductive adhesive, it is necessary to study the curing behavior of conductive adhesive. In this paper, the non isothermal curing characteristics of silicone conductive adhesives with dif ferent ratios were investigated by dynamic thermomechanical property test(DMA method). Mainly for the change curve of storage modulus, the curing activation energy, reaction order and other curing reaction kinetic parameters of silicone conductive adhesives were calculated by Kissinger equation, Crane equation and Ozawa equation, providing basic data for the preparation and application of conductive silica gel for electromagnetic shielding.

关 键 词：导电硅胶 固化活化能 反应级数 

分 类 号：TQ336.8[化学工程—橡胶工业]