Heat Transfer Performance and Structural Optimization of a Novel Micro-channel Heat Sink  

作　　者：Jianhua Xiang Liangming Deng Chao Zhou Hongliang Zhao Jiale Huang Sulian Tao 

机构地区：[1]School of Mechanical and Electrical Engineering,Guangzhou University,Guangzhou 510006,China [2]Department of Mechanical and Electrical Engineering,Xiamen University,Xiamen 361005,China [3]Department of Mechanical Engineering,Guangdong Technical College of Water Resources and Electric Engineering,Guangzhou 510925,China

出　　处：《Chinese Journal of Mechanical Engineering》2022年第2期189-200,共12页中国机械工程学报（英文版）

基　　金：Supported by the National Natural Science Foundation of China(Grant Nos.51975135 and 52005422);Guangzhou Science and Technology Project(Grant No.201707010429);Special Innovation Projects of Universities in Guangdong Province(Grant No.2018GKTSCX085).

摘　　要：With the advent of the 5G era,the design of electronic equipment is developing towards thinness,intelligence and multi-function,which requires higher cooling performance of the equipment.Micro-channel heat sink is promising for the heat dissipation of super-thin electronic equipment.In this study,thermal resistance theoretical model of the micro-channel heat sink was first established.Then,fabrication process of the micro-channel heat sink was introduced.Subsequently,heat transfer performance of the fabricated micro-channel heat sink was tested through the developed testing platform.Results show that the developed micro-channel heat sink has more superior heat dissipation performance over conventional metal solid heat sink and it is well suited for high power LEDs application.Moreover,the micro-channel structures in the heat sink were optimized by orthogonal test.Based on the orthogonal optimization,heat dissipation performance of the micro-channel radiator was further improved.

关 键 词：MICRO-CHANNEL Phase change heat sink Heat transfer performance testing Finite element simulation Orthogonal test 

分 类 号：TK124[动力工程及工程热物理—工程热物理]