超短脉冲激光加工在微电/光互连领域的应用研究进展  

Application of Ultrashort Pulse Laser Manufacturing in Microelectrical/Optical Interconnection

作　　者：孙小燕[1,2] 梁昶 张伟 孔德键 冯玉婷 胡友旺 段吉安[1,2] Sun Xiaoyan;Liang Chang;Zhang Wei;Kong Dejian;Feng Yuting;Hu Youwang;Duan Ji’an(College of Mechanical and Electrical Engineering,Central South University,Changsha 410083,Hunan,China;State Kei/Laboratory of High Performance Complex Manufactiiring,Changsha 410083,Hunan,China)

机构地区：[1]中南大学机电工程学院,湖南长沙410083 [2]高性能复杂制造国家重点实验室,湖南长沙410083

出　　处：《中国激光》2022年第10期119-142,共24页Chinese Journal of Lasers

基　　金：国家自然科学基金(51875584,51875585);电子元器件可靠性物理及其应用技术重点实验室开放基金(20D10);湖南省自然科学基金(2020JJ4247)。

摘　　要：超短脉冲激光凭借其脉宽窄、峰值功率高的特点,可以实现高精度材料生长、改性和去除等形式的加工,具有良好的材料适应性和工艺兼容性,在微电/光互连领域取得了开拓性应用进展,已成为近年来先进制造的新兴关键技术。本文简要介绍超短脉冲激光实现微光电子器件制造的基本机制,包括多光子还原、表面等离子体共振和双光子聚合等,重点阐述超短脉冲激光加工在微光/电互连领域的应用研究进展,并对超短脉冲激光加工在该领域的发展方向进行总结和展望。Objective Significanceelectronic and information devices are becoming increasingly miniaturized and portable with technologicaladvancements.These advancements require high-density distribution of device function units.This introduces new challenges to the electrical and optical interconnection technology among function units.Some techniquessuch as photolithography and electron beam have been developed for fabricating microelectrical and microopticaldevices.Although these methods have high resolution,they are inflexible for three-dimensional(3D)fabrication.Ultrafast pulse lasers are a versatile tool for fabricating microelectrical/optical devices owing to their highresolution,minimal thermal effect,and flexibility.In this study,we briefly introduce the basic mechanism of ultrashort pulse lasers for microelectrical/optical interconnection,including multiphoton-induced reduction,surface plasmonresonant,and two-photon photopolymerization.Furthermore,this study focuses on the application of ultrafast laser manufacturing in microelectrical/optical interconnection.Progress Accordingto different applications,femtosecond laser interconnect technology can be categorized into electrical and optical interconnections.Between them,electrical interconnection technology can be used to connect zero-,one-,and two-dimensional nanomaterials.For zero-dimensional nanomaterials,ultrafast laser-induced interconnection mechanisms include multiphoton reduction,photodynamic assembly,and selective laser sintering.Multiphoton reduction is a high-resolution approach for 3D electrical interconnection owing to the multiple absorptions induced in the metal-ion precursor(Fig.1).To improvethe quality of electrical structures,surfactant(Fig.2)or polymeric matrix(Fig.3)is added to the precursorto avoid the diffusion of ions.In addition,photodynamic assembly for electrical interconnection is developedto address the diffusion of metal ions in the precursor.This method uses laser-driven force to capture and connect nanoparticles(Fig.4).Furthermore,sele

关 键 词：激光技术 超短脉冲激光 多光子还原 表面等离子体共振 双光子聚合 光波导 

分 类 号：TN249[电子电信—物理电子学]