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作 者:屈方方 张亚平[1] 和智殷 Qu Fangfang;Zhang Yaping;He Zhiyin(College of Energy Engineering,Xian University of Science and Technology,Xian 710054,China)
出 处:《低温与超导》2022年第5期42-46,84,共6页Cryogenics and Superconductivity
基 金:国家自然科学基金(51504188)资助。
摘 要:热管在高频高速电子元件散热方面应用广泛,以其稳定、均温性好且响应快为优势。针对大功率电子器件的紧凑高效集成,以提高热流密度为目标,设计了一种新型沟槽热管模块。对该沟槽热管进行稳态和瞬态热性能响应实验研究,研究了四种不同规格的热管匹配四种不同针柱翅片散热器的功率散热模块。结果表明,沟槽热管在整个模块散热中占比66.1%,在高功率电子元件散热时采用模拟电源散热单位面积、沟槽道平板热管单边面积、针柱散热器底盘面积比为1:16:16的模块,面积比为1:16:16、1:16:9和1:9:16的模块展示了最佳散热性能,最低热阻分别可达到0.16 K/W、0.19 K/W和0.21 K/W,面积比为1:16:1.57、1:16:9、1:16:16的模块在加热功率为16 W时启动时间为400 s,可更好保护电子元件。Heat pipe is widely used in heat dissipation for high-frequency and high-speed electronic components, and has the advantages of stability, good temperature uniformity and fast response. For the compact and efficient integration of high-power electronic devices, with the goal of increasing the heat flow density, a new type of groove heat pipe module was designed. The steady-state and transient thermal performances of the grooved heat pipe were experimentally studied. The heat dissipation modules of four different specifications of heat pipes matched with four different fin radiators were discussed. The results show that the grooved heat pipe accounts for 66.1% of the heat dissipation of the whole module. In the heat dissipation of high-power electronic components, the proportions among the unit area of analog power supply heat dissipation, the unilateral area of the channel flat heat pipe and the chassis area ratio of the needle-and-column radiator in the module are 1:16:16. Modules with three kinds of area ratios of 1:16:16, 1:16:9 and 1:9:16 demonstrate optimal heat dissipation, and the minimum thermal resistance can reach 0.16 K/W, 0.19 K/W and 0.21 K/W respectively. Modules with three kinds of area ratio of 1:16:1.57, 1:16:9 and 1:16:16 have a starting time of 400 s when the heating power is 16 W, which can better protect the electronic components.
分 类 号:TK172[动力工程及工程热物理—热能工程]
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