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作 者:吴加雪 唐超 张天栋 迟庆国[1,2] WU Jiaxue;TANG Chao;ZHANG Tiandong;CHI Qingguo(School of Electrical and Electronic Engineering,Harbin University of Science and Technology,Harbin 150080,China;Key Laboratory of Engineering Dielectrics and Its Application,Ministry of Education,Harbin University of Science and Technology,Harbin 150080,China)
机构地区:[1]哈尔滨理工大学电气与电子工程学院,哈尔滨150080 [2]哈尔滨理工大学工程电介质及其应用教育部重点实验室,哈尔滨150080
出 处:《复合材料学报》2022年第5期2183-2191,共9页Acta Materiae Compositae Sinica
基 金:黑龙江省自然科学基金(TD2019E002);国家自然科学基金区域创新发展联合基金(U20A20308)。
摘 要:双酚A环氧树脂(EP)因其具有优异电绝缘性能而被广泛应用于电子器件中,但EP的热导率较低,通过填充高导热无机填料而构建导热通路是当前提高聚合物复合材料热导率的有效策略。本文综合利用溶液共混与热压工艺制备得到了六方氮化硼(h-BN)-四针状氧化锌晶须(T-ZnOw)/EP复合材料,并对复合材料的微观形貌与物相结构、导热性能及绝缘性能进行了系统表征与分析。结果表明,复合填充h-BN-T-ZnOw/EP复合材料兼具良好的导热性和绝缘性,当h-BN-T-ZnOw的填充含量为30wt%/5wt%时,25℃下热导率为0.55 W/(m·K),相比于纯EP提升了2.9倍,同时复合材料体积电阻率大于10^(15)Ω·m,表现出良好的绝缘性。Phenolic epoxy resin(EP)is widely used in electronics because of its excellent electrical insulating properties.The thermal conductivity of EP is low,and filling the highly conductive thermal inorganic fillers is an effective way to construct the thermal conductive pathway of the thermal transport frame to improve the thermal conductivity of polymer composites.In this paper,the hexagonal boron nitride(h-BN)-four needle zinc oxide whisker(T-ZnOw)/EP composite was prepared by solution blended and hot-compaction process.The microstructures aspects,phase structures,thermal conductivity and electric insulating propertis of composites were systematically characterized and analyzed.The results show the h-BN-T-ZnOw/EP composite has good thermal conductivity and electrical insulating properties.When h-BN-T-ZnOw loading is 30wt%/5wt%,the thermal conductivity at 25℃is 0.55 W/(m·K),which is 2.9 times higher than that of EP,and its volume resistivity is greater than 10^(15)Ω·m.
关 键 词:双酚A环氧树脂 热导率 导热通路 电绝缘性 氮化硼 氧化锌
分 类 号:TM215.92[一般工业技术—材料科学与工程]
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