Cu对低合金高强钢熔敷金属有效晶粒尺寸的影响  

Effect of Cu on effective grain size of deposited metal in HSLA steel

作　　者：王爱华 王晶 Wang Aihua;Wang Jing(Hebei Petroleum University of Technology,Chengde 067000,Hebei,China)

机构地区：[1]河北石油职业技术大学,河北承德067000

出　　处：《焊接》2022年第4期43-47,共5页Welding & Joining

基　　金：国家重点基础研究发展计划(973)项目(2010CB630800)。

摘　　要：通过透射电镜和电子背散射衍射技术,研究了Cu对低合金高强钢熔敷金属有效晶粒尺寸的影响。研究结果表明,熔敷金属的组织主要由板条状贝氏体和板条马氏体组成,随Cu含量由0.052%增加到0.53%,板条结构变得细小致密;当Cu含量为0.052%时,有效晶粒的平均尺寸为2.39μm,当Cu含量增加到0.24%时,有效晶粒的平均尺寸减小到2.18μm,当Cu含量继续增加到0.53%时,有效晶粒的平均尺寸最终减小到1.99μm,随Cu含量的增加,有效晶粒得到细化。The effect of Cu on effective grain size of deposited metal in HSLA steel was investigated by TEM and EBSD.Experiment results indicated that microstructure of deposited metal was composed of lath bainite and lath martensite,increase of Cu content from 0.052%to 0.53%resulted in refining of lath configuration.When Cu content was 0.052%,the mean size of effective grain was 2.39μm.When Cu conted was increased to 0.24%,it was 2.18μm.When it continued to increase to 0.53%,the mean effectiue grain size was 1.99μm.With the increase of Cu content,the effective grain were refined.

关 键 词：CU含量 熔敷金属 有效晶粒尺寸 

分 类 号：TG401[金属学及工艺—焊接]