基于相变温度梯级布置的温控特性研究  

Numerical Investigation on Temperature Control Characteristics Based on Phase Change Temperature Gradient Arrangement

作　　者：杨萍[1] 童旋 曾敏[1] 王秋旺[1] YANG Ping;TONG Xuan;ZENG Min;WANG Qiuwang(Key Laboratory of Thermo-Fluid Science and Engineering,Ministry of Education,Xi’an Jiaotong University,Xi’an 710049,China)

机构地区：[1]西安交通大学热流科学与工程教育部重点实验室,西安710049

出　　处：《工程热物理学报》2022年第6期1625-1630,共6页Journal of Engineering Thermophysics

基　　金：国家自然科学基金资助项目(No.51776157)。

摘　　要：相变温控因为结构简单、性能可靠、经济节能等优点,广泛应用于各类设备温控,尤其是电子设备。本文针对电子芯片相变温控,提出了基于相变温度梯级布置的温控新想法,利用COMSOL软件数值模拟研究了温控效果,结果表明,梯度布置相变材料的相变温度具有优化控温的潜力,且梯度温差并非越大或越小越好,本文条件下梯度温差为6 K时控温优化效果最好,相对无梯度布置的最优工况可延长芯片正常工作时间188 s,时间相对延长10.7%。With the advantages of simple structure,reliable performance and lower cost,phasechange temperature control is widely used in all kinds of equipment temperature control,especially electronic equipment.In this paper,a new idea of phase-change temperature control based on phase transition temperature gradient arrangement is proposed to optimize the temperature control and then the phase change heat transfer process is studied numerically by COMSOL software.It is proved that the new idea has the potential to optimize the temperature control,and the gradient temperature difference is not the greater or smaller the better.In this paper,the result is best when the gradient temperature difference is 6 K.Compared with the optimal condition without temperature gradient arrangement,the working time of the chip can be extended by 188 s,and the time can be extended by 10.7%.

关 键 词：梯级布置 相变温控 数值模拟 

分 类 号：TK124[动力工程及工程热物理—工程热物理]