某毫米波功放组件液冷散热设计  

Liquid-cooling Heat Dissipation Design of a Millimeter-wave Power Amplifying Component

作　　者：杜林秀 DU Linxiu(The 29th Research Institute of CETC,Chengdu 610036,China)

机构地区：[1]中国电子科技集团公司第二十九研究所,四川成都610036

出　　处：《电子机械工程》2022年第3期31-34,38,共5页Electro-Mechanical Engineering

摘　　要：随着雷达技术的提升,阵列化排布的毫米波功放组件逐渐应用于相控阵体制的雷达之中。体积小、散热量大、热流密度高是毫米波功放组件的典型特征。如何在极小的体积内实现功放组件的液冷散热集成成为毫米波相控阵体制雷达应用的瓶颈。文中通过对功放组件的结构进行优化设计,实现在5 mm组阵间距条件下功放组件的液冷散热集成,对毫米波功放组件的流量特性与温度特性进行数值求解,通过电气补偿电路消除核心芯片温度分布的影响。With improvement of radar technology, the millimeter-wave power amplifying components arranged in arrays are gradually applied to the phased array radar. The small size, large heat dissipation capacity and high heat flux density are the typical characteristics of the millimeter-wave power amplifying components. The liquid cooling and heat dissipation of the power amplifying components are the core issues of the millimeterwave phased array radar. In this paper, the structure of the power amplifying components has been optimized,the liquid-cooling heat dissipation integration of the power amplifying components is realized under the condition of 5 mm array spacing. The flow and temperature distribution of the millimeter-wave power amplifying components are simulated numerically and the influence of the core chip temperature distribution has been eliminated through the electrical compensation circuit.

关 键 词：毫米波功放组件 液冷 散热 

分 类 号：TK124[动力工程及工程热物理—工程热物理]