Trending IC design directions in 2022  

作　　者：Chi-Hang Chan Lin Cheng Wei Deng Peng Feng Li Geng Mo Huang Haikun Jia Lu Jie Ka-Meng Lei Xihao Liu Xun Liu Yongpan Liu Yan Lu Kaiming Nie Dongfang Pan Nan Qi Sai-Weng Sin Nan Sun Wenyu Sun Jiangtao Xu Jinshan Yue Milin Zhang Zhao Zhang 

机构地区：[1]University of Macao,Macao 999078,China [2]University of Science and Technology of China,Hefei 230026,China [3]Tsinghua University,Beijing 100084,China [4]Institute of Semiconductors,Chinese Academy of Sciences,Beijing 100083,China [5]Xi’an Jiaotong University,Xi’an 710049,China [6]Chinese University of Hong Kong,Shenzhen 518172,China [7]Tianjin University,Tianjin 300072,China

出　　处：《Journal of Semiconductors》2022年第7期8-54,共47页半导体学报（英文版）

摘　　要：For the non-stop demands for a better and smarter society, the number of electronic devices keeps increasing exponentially;and the computation power, communication data rate, smart sensing capability and intelligence are always not enough. Hardware supports software, while the integrated circuit(IC) is the core of hardware. In this long review paper, we summarize and discuss recent trending IC design directions and challenges, and try to give the readers big/cool pictures on each selected small/hot topics. We divide the trends into the following six categories, namely, 1) machine learning and artificial intelligence(AI) chips, 2) communication ICs, 3) data converters, 4) power converters, 5) imagers and range sensors, 6) emerging directions. Hope you find this paper useful for your future research and works.

关 键 词：integrated circuit design artificial intelligence(AI) radio frequency(RF)circuits data converters power management IMAGER SENSOR CRYOGENIC BIOMEDICAL 

分 类 号：TN402[电子电信—微电子学与固体电子学]