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作 者:胡光辉[1] 崔子雅 郑沛峰 王治安 潘湛昌[1] 张波 HU Guanghui;CUI Ziya;ZHENG Peifeng;WANG Zhian;PAN Zhanchang;ZHANG Bo(School of Chemical Engineering and Light Industry,Guangdong University of Technology,Guangzhou 510006,China;Guangdong Lear Chemicals Co.,Ltd.,Guangzhou 511475,China)
机构地区:[1]广东工业大学轻工化工学院,广东广州510006 [2]广东利尔化学有限公司,广东广州511475
出 处:《电镀与涂饰》2022年第11期765-769,共5页Electroplating & Finishing
摘 要:在硫酸盐体系化学镀镍液中添加1~10 mg/L聚乙烯亚胺(PEI),通过测厚法研究了PEI质量浓度对铜表面化学镀镍沉积速率的影响。对比了未添加和添加4 mg/L PEI时镍镀层的组织结构、韧性和耐蚀性。结果表明,随PEI质量浓度增大,沉积速率减小。镀液中添加4 mg/L PEI后,所得镍镀层P含量增大,表面更均匀和平整,韧性和耐蚀性更佳。Electroless nickel plating was conducted on copper by adding 1-10 mg/L polyethyleneimine(PEI)to a sulfate bath.The effect of PEI content on the deposition rate of electroless nickel plating was studied by coating thickness measurement.The microstructure,toughness,and corrosion resistance of the nickel coatings electrolessly plated with and without 4 mg/L PEI respectively were compared.The results showed that the deposition rate was reduced with the increasing of PEI content in the bath.After adding 4 mg/L of PEI to the bath,the obtained nickel coating featured a higher content of phosphorus,a more uniform and smooth surface,as well as better toughness and corrosion resistance.
关 键 词:化学镀镍 聚乙烯亚胺 沉积速率 组织结构 韧性 耐蚀性
分 类 号:TQ153.12[化学工程—电化学工业]
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