Bi元素添加对Sn1.0Ag低银无铅焊料性能的影响  

Effect of Bi Element Addition on the Properties of Sn1.0Ag LowAg Lead-free Solder

作　　者：李硕 白猛 王迎春[1] LI Shuo;BAI Meng;WANG Yingchun(College of Materials,Being Institute of Technology,Beiing 100081,China;School of Resources and Materials,Qinhuangdao Campus,Northeastern University,Hebei Qinhuangdao 066004,China)

机构地区：[1]北京理工大学材料学院,北京100081 [2]东北大学秦皇岛分校资源与材料学院,河北秦皇岛066004

出　　处：《河北师范大学学报（自然科学版）》2022年第4期358-362,共5页Journal of Hebei Normal University：Natural Science

摘　　要：为了降低Sn-Ag系焊料的熔点和成本,在Sn1.0Ag焊料中加入质量分数为x(x=0.5,1.0,2.0,3.0)的Bi元素,对焊料的物相成分、熔点、润湿性、拉伸性能、金属间化合物的形貌和厚度、焊点的剪切性能进行了研究,得出了Bi元素的添加对Sn1.0Ag焊料性能的影响规律.结果表明,Bi元素的加入可以降低焊料的熔点,提高焊料的润湿性和抗拉强度,抑制金属间化合物的过度生长,提高焊点的剪切强度;少量添加Bi元素,焊料的塑性上升,Bi元素添加量增大,断后伸长率反而降低,焊料的塑性下降.In order to reduce the melting point and cost of Sn-Ag solder,Bi element with mass fraction of x(x=0.5,1.0,2.0,3.0)is added to the Sn1.0Ag solder.The phase composition,melting point,wettability,tensile properties,morphology and thickness of intermetallic compounds,and shear properties of solder joints were investigated.The effect of the Bi addition on the properties of Sn1.0Ag solder is obtained.The results show that the addition of Bi can lower the melting point of the solder,improve the wettability and tensile strength of the solder,inhibit the excessive growth of intermetallic compounds,and improve the shear strength of the solder joints.When a small amount of Bi element is added,the plasticity of the solder increases.When the amount of Bi element is increased,the elongation after breaking decreases,and the plasticity of the solder decreases.

关 键 词：合金化 抗拉强度 金属间化合物 剪切强度 

分 类 号：Q938.8[生物学—微生物学] TG146.14[一般工业技术—材料科学与工程]