碲锌镉晶片表面精密抛光系统研究  

Study on Surface Precision Polishing System for CZT Wafer

作　　者：赵祥 张文斌[1] 张世民 高岳[1] ZHAO Xiang;ZHANG Wenbin;ZHANG Shimin;GAO Yue(The 45^(th) Research Institute of CETC,Beijing 100176,China)

机构地区：[1]中国电子科技集团公司第四十五研究所,北京100176

出　　处：《电子工业专用设备》2022年第1期8-11,共4页Equipment for Electronic Products Manufacturing

摘　　要：介绍了表面抛光的工艺过程和技术原理,对影响抛光质量的关键部件抛光盘主轴和承载器进行分析研究。通过抛光压力精密控制,抛光结果满足晶片表面平坦化要求。The process and technical principle of surface polishing are introduced,the key components those affect the polishing quality are analyzed and studied,such as the polishing disc spindle and carrier.By ways of polishing pressure precisely controlled,the polishing results meet the wafer surface planarization requirements.

关 键 词：碲锌镉 表面抛光 承载器 

分 类 号：TN305.2[电子电信—物理电子学]