红外焦平面探测器键合和剪切可靠性试验研究  

Study on bonding and shear reliability test of infrared focal plane detector

作　　者：刘若冰 王爽 陈勤 喻松林[2] 毛京湘[3] 陈洪雷[4] LIU Ruo-bing;WANG Shuang;CHEN Qin;YU Song-lin;MAO Jing-xiang;CHEN Hong-lei(China Electronic Standardization Institute,Beijing 100007;North China Reserch Institute of Electro-Optics,Beijing 100015,China;Kunming Institute of Physics,Kunming 650223,China;Shanghai Institute of Technical Physics,Chinese Academy of Sciences,Shanghai 200083,China)

机构地区：[1]中国电子技术标准化研究院,北京100007 [2]华北光电技术研究所,北京100015 [3]昆明物理研究所,云南昆明650223 [4]中国科学院上海技术物理研究所,上海200083

出　　处：《激光与红外》2022年第6期861-869,共9页Laser & Infrared

摘　　要：红外焦平面探测器可靠性与生产研制工艺过程控制要求密切相关。本文对探测器的可靠性考核思路进行了分析,结合目前标准中可靠性试验存在的问题,对芯片和杜瓦组装过程中的引线键合强度、芯片剪切强度开展了试验研究,为指导红外焦平面探测器的研制生产、全面评价其质量和可靠性提供依据,为后续红外焦平面探测器的标准制修订工作奠定基础。The reliability of infrared focal plane array detectors is is intimately connected with the manufacturing process control requirements.In this paper,the idea of reliability assessment of detector is analyzed.Referring to the problems of reliability tests in current standards,during chip and Dewar assembly,die shear strength and wire bonding strength tests were studied.The research results provide the basis for guiding the development and production of infrared focal plane array detectors,evaluating their quality and reliability,and laying the foundation of the standard preparation for the infrared(IR)detectors field.

关 键 词：红外焦平面探测器 可靠性 引线键合强度 芯片剪切强度 

分 类 号：TN214[电子电信—物理电子学]