热压铸成型工艺中的模具设计方法分析  

Analysis of Mould Design Method for Hot Injection Moulding Process

作　　者：李迎迎 高鸣[1] 梁迎春[1] LI Ying-ying;GAO Ming;LIANG Ying-chun(Beijing Vacuum Electronics Research Institute,Beijing 100015,China)

机构地区：[1]北京真空电子技术研究所,北京100015

出　　处：《真空电子技术》2022年第3期75-79,共5页Vacuum Electronics

摘　　要：本文以自行设计的热压铸成型模具为基础,分析探讨了在电子陶瓷制造中热压铸成型工艺的模具设计方法和思路,包括进浆方向确定和进浆口设计、模具分型和排气设计,模具设计便于脱模以及模具机械加工的设计方法,以供该领域从业者参考。Based on the self-designed hot injection mould,the mould design method and design idea for hot injection moulding process in electronic ceramic manufacturing are discussed,including slurry inletting direction and inlet design,mould parting and exhausting design,mould design for easy demoulding and the design method for mould machining.The design method can be used as a reference for practitioners in this field.

关 键 词：电子陶瓷 热压铸成型 模具设计方法 

分 类 号：TN105[电子电信—物理电子学]