接触热阻在加固计算机热设计中的分析研究  

Analysis and Research of Contact Thermal Resistance in Thermal design of Rugged Computer

作　　者：李风新 LI Fengxin(System Department 9,The 15th Research Institute of China Electronic Technology Corporation,Beijing 100083,China)

机构地区：[1]中国电子科技集团公司第十五研究所系统九部,北京100083

出　　处：《机械工程师》2022年第7期106-109,共4页Mechanical Engineer

摘　　要：在加固计算机热设计中,接触热阻直接影响着热传导结构的导热效率,尤其是发热芯片和冷板之间的接触热阻,造成芯片和冷板之间存在较大温差。通常在发热芯片和冷板之间填充导热介质的方式降低导热接触面的接触热阻,提高热源的一级导热效率。通过分析接触热阻的存在机理和影响因素,给出了工程实际中的降低接触热阻的方法措施。并针对相变导热膏、导热衬垫、石墨和铟箔等应用普遍的导热介质,依据工程应用经验,给出了各导热介质的性能指标、应用场合和优缺点。通过对各降低接触热阻措施效果的数值分析对比,得出了在加固计算机热设计中降低接触热阻的性能差异,对于工程设计应用具有普遍性的指导意义。In the thermal design of rugged computer,the contact thermal resistance directly affects the efficiency of thermal conduction in the heat conducting structure,especially the contact thermal resistance between the heating chip and the cold plate,resulting in a large temperature difference between the chip and the cold plate.Generally,the heat conducting medium is filled between the heating chip and the cold plate to reduce the contact thermal resistance of the heat conducting contact surface and improve the primary heat conduction efficiency of the heat source.The methods and measures to reduce contact thermal resistance in engineering practice are proposed by analyzing the existence mechanism and influencing factors of contact thermal resistance.Aiming at the commonly used thermal conducting medium such as phase change thermal conductive paste,thermal pad,graphite and indium foil,this paper introduces the performance indexes,application occasions,advantages and disadvantages of each heat conducting medium according to the engineering application experience.Through the numerical analysis and comparison of the effects of various measures to reduce contact thermal resistance,the performance difference of reducing contact thermal resistance in the thermal design of rugged computer is obtained,which has universal guiding significance for engineering design and application.

关 键 词：接触热阻 热设计 热传导 导热效率 导热介质 加固计算机 

分 类 号：TP368[自动化与计算机技术—计算机系统结构]