焊接温度对5A06铝合金瞬时液相扩散焊接头组织与性能的影响  

Effect of Bonding Temperature on Microstructure and Properties of 5A06 Aluminum Alloy Transient Liquid Phase Diffusion Bonding Joint

作　　者：李振豪 赵丕峰[1] 苗鑫 姚尚君 陈思杰[1] LI Zhenhao;ZHAO Pifeng;MIAO Xin;YAO Shangjun;CHEN Sijie(School of Materials Science and Engineering,Henan Polytechnic University,Jiaozuo 454000,China)

机构地区：[1]河南理工大学材料科学与工程学院,焦作454000

出　　处：《机械工程材料》2022年第3期45-50,共6页Materials For Mechanical Engineering

基　　金：河南省教育厅科技攻关项目(14B430002)。

摘　　要：采用Al-Cu-Si-Ni非晶箔作为中间层,在氩气保护下对5A06铝合金进行瞬时液相扩散焊,焊接时间为10min,焊接压力为2.5MPa,研究了焊接温度(550~590℃)对接头组织和性能的影响。结果表明:焊接温度的升高可以促进中间层降熔元素铜、硅、镍的扩散,减少焊缝组织中脆性相的生成,从而提高接头的抗拉强度,但焊接温度为590℃时,接头抗拉强度下降;在试验条件下连接5A06铝合金的最佳焊接温度为580℃,此时中间层降熔元素与母材间扩散充分,接头连接界面模糊,接头质量较好,焊缝中心硬度最低,为76.5HV,抗拉强度最大,达到239MPa,断裂方式为韧性断裂。Transient liquid phase diffusion bonding of 5A06aluminum alloy was carried out by using Al-Cu-Si-Ni amorphous foil as the interlayer in argon protection atmosphere with banding time of 10min and bonding pressureof2.5MPa.Theinfluencesofbonding temperature(550—590℃)on the microstructure and performance of joints were studied.The results show that the increase of bonding temperature could promote the diffusion of interlayer melting point depressant elements(Cu,Si and Ni),and reduce the formation of brittle phase in weld microstructure,and thus improve the tensile strength of the joint;but the tensile strength of the joint decreased when the bonding temperature was 590℃.The optimum bonding temperature was 580℃under test conditions;at this point,the diffusion of melting point depressant elements between the interlayer and the base metal was sufficient,and the joint interface was fuzzy,indicating the joint quality was good;the weld center had the smallest hardnessof76.5HVandthelargest tensile strength of 239MPa,and the fracture mode was ductile fracture.

关 键 词：5A06铝合金 瞬时液相扩散焊 焊接温度 组织 抗拉强度 

分 类 号：TG453[金属学及工艺—焊接]