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作 者:李远远[1] 颜敏[1] LI Yuanyuan;YAN Min(Patent Examination Cooperation Jiangsu Center of The Patent Office,CNIPA,Suzhou 215000,Jiangsu China)
机构地区:[1]国家知识产权局专利局专利审查协作江苏中心,江苏苏州215000
出 处:《锻压装备与制造技术》2022年第3期79-81,共3页China Metalforming Equipment & Manufacturing Technology
摘 要:激光微加工过程中,加工区域附近会存在热影响区、重铸层、热变形和裂纹等缺陷,这将直接影响加工质量和加工精度。因此,在激光微孔加工过程中,如何减小微孔锥度、微孔表面重铸层、微裂纹以及如何实现高深径比微孔的加工一直是提高微孔加工质量的主要研究方向。本文主要对现有激光微孔加工微孔质量的控制方式进行总结与研究。In the process of laser micro-machining,there will be defects such as heat affected zone,recast layer,thermal deformation and cracks near the machining area,which will directly affect the machining quality and machining accuracy.Therefore,in the process of laser micro-hole processing,the way to reduce the micro-hole taper,micro-hole surface recast layer,micro-cracks and realize the processing of high aspect ratio micro-holes has always been the main research direction to improve the quality of micro-hole processing.The existing control methods of micro-hole quality for laser micro-hole processing have been summarized and studied.
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