Al/TPG叠层复合结构导热性能的数值研究  

Numeric Research on Heat Transfer in Al/TPG Laminated Structure

作　　者：鲍睿 Bao Rui(NO.38 Research Institute of CETC,Anhui Hefei 230088)

机构地区：[1]中国电子科技集团第三十八研究所,安徽合肥230088

出　　处：《电子质量》2022年第6期18-21,共4页Electronics Quality

摘　　要：针对高功率电子元器件的散热需求,该文以高导热Al/TPG叠层复合结构为研究对象,基于有限元方法,应用ANSYS软件对该叠层复合结构的导热性能进行了仿真分析。对比分析了平行结构和T型结构两种复合构型对Al/TPG叠层复合结构导热性能的影响,综合考虑了Al/TPG间的界面热阻对复合结构导热性能的影响。分析结果表明T型Al/TPG叠层复合结构具有更好的传热性能,Al/TPG间的界面热阻对该结构的导热性能有显著影响。Aiming at the heat dissipation of high power density electronics, this paper takes Al/pyrolytic graphite(Al/TPG) laminated structure as research objects, and heat transfer in the laminated structure is simulated by using Ansys software. This paper discusses the heat conduction function of T type laminated structure in compared with the paral el laminated structure, and investigates the impact of the interface thermal resistance between aluminum and TPG on the heat conduction function of the T type laminated structure. The results of analysis indicate that the T type laminated structure has the better heat conduction function, and the interface thermal resistance can significantly influence the heat conduction function of the Al/TPG laminated structure.

关 键 词：导热性能 热解石墨 叠层结构 有限元 

分 类 号：TB33[一般工业技术—材料科学与工程]