微波腔体选区镀金工艺技术应用研究  

Research on Process Technology of Local Gilding on Microwave Cavity

作　　者：王宇[1] 张宇 周杰文 董东[1] 李琳[1] Wang Yu;Zhang Yu;Zhou Jie-wen;Dong Dong;Li Lin(The 29th Research Institute of CETC,Sichuan Chengdu 610036)

机构地区：[1]中国电子科技集团公司第二十九研究所,四川成都610036

出　　处：《电子质量》2022年第6期128-131,共4页Electronics Quality

摘　　要：随着微电子技术的飞速发展,微波组件集成度越来越高,整体镀镍的微波腔体容易氧化,致使电阻增大,难以满足混合集成电路组件中对接地敏感元器件的装配要求,整体镀金的微波腔体难以满足大量绝缘子连接器一次性锡铅焊接的气密性,同时,焊料流布难以受控,该文通过微波腔体选区镀金工艺的应用验证,包括镀层外观、镀层厚度、镀层结合力、接地电阻以及焊接气密性等,表明微波腔体选区镀金工艺能够有效地提高微波组件集成质量和效率。With the rapid development of microelectronics technology,microwave components are becoming more and more integrated.Nickel-plated cavity is easy to be oxidized,which causes an increase in resistance value.It cannot meet the requirements of grounding components.At the same time,the fully gold-plated cavity cannot meet the demand of the air tightness of connector welding,the solder flow is uncontrollable.In this paper,we research the processing technology of local gilding on microwave cavity,such as the planting layer,the thic kness of the coating,the adhesion of the coating,the grounding resistance and the welding air tightness indicate.We found that the local gold plating process of microwave cavity can improve the quality and efficiency of micro wave devices.

关 键 词：微波腔体 选区镀金 锡铅焊接 

分 类 号：TQ153.18[化学工程—电化学工业] TN405[电子电信—微电子学与固体电子学]