Recalescence Velocity and Microstructure Evolution of Deeplyundercooled Cu_(65)Ni_(35) Alloy  

作　　者：LIANG Hailong CHENG Tang LI Ruiqin WANG Hongfu YANG Jine XIE Jinpeng ZHAO Yuhong 梁海龙;CHENG Tang;李瑞琴;WANG Hongfu;YANG Jine;XIE Jinpeng;赵宇宏(College of Mechanical Engineering,North University of China,Taiyuan 030051,China;College of Materials Science and Engineering,North University of China,Taiyuan 030051,China;Shanxi College of Technology,Shuozhou 036000,China;Jiangsu Yingchuang Power Technology Co.Ltd,Suzhou 215000,China)

机构地区：[1]College of Mechanical Engineering,North University of China,Taiyuan 030051,China [2]College of Materials Science and Engineering,North University of China,Taiyuan 030051,China [3]Shanxi College of Technology,Shuozhou 036000,China [4]Jiangsu Yingchuang Power Technology Co.Ltd,Suzhou 215000,China

出　　处：《Journal of Wuhan University of Technology(Materials Science)》2022年第2期277-284,共8页武汉理工大学学报（材料科学英文版）

基　　金：Funded by the National Natural Science Foundation of China(No.51701187);the Basic Applied Research Projects in Shanxi Province(201801D221151)。

摘　　要：The Cu_(65)Ni_(35) alloy liquid was undercooled by the fluxing method,and the rapid solidification structure was obtained by natural cooling.The solidification interface migration information of Cu_(65)Ni_(35) alloy liquid in rapid solidification stage was photographed with the help of high-speed camera,and the recalescence velocity was calculated.The microstructure evolution of the alloy was systematically studied by observing the microstructure morphology and taking photos on the metallographic microscope.By analyzing the evolution of dendrite grain size and microstructure microhardness with undercoolingand relying on electron backscatter diffraction(EBSD)technology,the grain refinement mechanism of microstructure under high undercooling and low undercooling is finally confirmed.

关 键 词：rapid solidification recalescence velocity microstructure evolution 

分 类 号：TG166.2[金属学及工艺—热处理]