QFN封装埋嵌铜块印制板散热研究  

Study of embedded copper coin Printed Circuit Board of QFN package using thermal analysis

作　　者：冯立 张庆军[1,2] 李银 Feng Li;Zhang Qingjun;Li Yin

机构地区：[1]四川九洲电器集团有限责任公司,四川绵阳621000 [2]四川省航电系统产品轻量化设计与制造工程实验室,四川绵阳621000

出　　处：《印制电路信息》2022年第7期11-14,共4页Printed Circuit Information

摘　　要：通过对底部散热QFN封装类器件的印制板内嵌入散热铜块,构建嵌埋铜块印制板散热模型。选取了不同的嵌埋入铜块尺寸,通过热仿真软件进行仿真分析,确定了铜块尺寸对QFN封装芯片结温的影响趋势,结果表明,随着铜块尺寸增加,QFN封装芯片结温减小,印制板散热性能得到极大提升。By embedding the heat dissipation copper block into the printed board of QFN packaging devices at the bottom,the heat dissipation model of the printed board embedded with copper block is constructed.Different embedded copper block sizes are selected and simulated by thermal simulation software.The influence trend of copper block size on the junction temperature of QFN packaging chip is determined.The results show that with the increase of copper block size,the junction temperature of QFN packaging chip decreases and the heat dissipation performance of printed board is greatly improved.

关 键 词：嵌埋入铜块 热仿真 印制板 导热系数 

分 类 号：TN41[电子电信—微电子学与固体电子学]