聚酰亚胺树脂改性环氧树脂用于金属基覆铜板的研究  

Study on polyimide resin modified epoxy resin for metal based Copper Clad Laminate

作　　者：林晨 梁远文 蔡旭峰 Lin Chen;Liang Yuanwen;Cai Xufeng(TOTKING TECHNOLOGY CO.,LTD.)

机构地区：[1]广东全宝科技股份有限公司,广东珠海519125

出　　处：《印制电路信息》2022年第6期12-17,共6页Printed Circuit Information

摘　　要：通过使用具有特定结构的聚酰亚胺树脂对环氧树脂进行改性,并将该树脂组合物在金属基覆铜板中进行应用,从而提高金属基覆铜板的热稳定性、韧性等性能。对聚酰亚胺树脂改性环氧树脂工艺在金属基覆铜板行业的发展前景进行展望。By using a polyimide resin with a specific structure to modify the epoxy resin and applying the resin composition in the metal-based copper clad laminate,the thermal stability,toughness and other properties of the metal-based copper clad laminate are improved.The development prospects of polyimide resin modified epoxy resin technology in the metal-based copper clad laminate industry are prospected.

关 键 词：聚酰亚胺 环氧树脂 金属基覆铜板 改性 耐高温 

分 类 号：TN41[电子电信—微电子学与固体电子学]