印制板上半金属化孔直接成型工艺研究  

Research on direct forming process of half-plating through hole on PCB

作　　者：陈志宇 乔鹏程 梁龙化 Chen Zhiyu;Qiao Pengcheng;Liang Longhua

机构地区：[1]通元科技(惠州)有限公司,广东惠州516000

出　　处：《印制电路信息》2022年第6期28-32,共5页Printed Circuit Information

摘　　要：文章以新型外形加工高精密设备为基础,结合CAM设计、工艺参数优化,研发新的高精度,高稳定性的半金属化孔制作方法,保证半金属孔板一次直接成型,不扯铜、无披锋、无毛刺,孔边左右对称,提高生产效率及成品良率。Based on the new shape processing high-precision equipment,combined with CAM design,process parameter optimization,this paper develops a high precision,high stability process to produce metal holes and ensure the direct form of a half-plating through hole which has no copper,no burr,and has hole left and right symmetry which improves the production efficiency and product yield.

关 键 词：半金属化孔 直接成型 PCB 

分 类 号：TN41[电子电信—微电子学与固体电子学]