用粗纱玻纤布覆铜板生产小埋孔HDI板引起CAF的探讨  

Discussion on CAF caused by small buried hole HDI board produced by coarse glass fiber cloth CCL

作　　者：张俊杰 罗海春 Zhang Junjie;Luo Haichun

机构地区：[1]江西红板科技股份有限公司,江西吉安343100

出　　处：《印制电路信息》2022年第6期50-54,共5页Printed Circuit Information

摘　　要：HDI板使用7628粗玻璃纤维布压制的覆铜板作为埋孔板芯板,当埋孔板的埋孔间距较小,出现CAF问题的几率增大,为此做出相应改进措施。The copper clad laminate pressed with 7628 coarse glass fiber cloth is used as the core board of the buried hole board.When the buried-hole spacing is small,the probability of CAF will increase.For this reason,improvement methods are made.

关 键 词：粗玻璃纤维布 芯板 小埋孔间距 阳极导电丝 

分 类 号：TN41[电子电信—微电子学与固体电子学]