Round Robin Study on the Thermal Conductivity/Diffusivity of a Gold Wire with a Diameter of 30μm Tested via Five Measurement Methods  

作　　者：ABE Ryo SEKIMOTO Yuki SAINI Shirkant MIYAZAKI Koji LI Qin-Yi LI Dawei TAKAHASHI Koji YAGI Takashi NAKAMURA Masakazu 

机构地区：[1]division of materials science,nara institute of science and technology,ikoma 630-0192,japan [2]department of mechanical and control engineering,kyushu institute of technology,kitakyushu 804-8550,japan [3]department ofaeronautics and astronautics,kyushu university,fukuoka819-0395,japan [4]international institute for carbon-neutral energy research(wpi-i2cner),kyushu university,fukuoka 819-0395,japan [5]national metrology institute of japan national institute of advanced industrial science and technology,tsukuba 305-8565,japan

出　　处：《Journal of Thermal Science》2022年第4期1037-1051,共15页热科学学报（英文版）

基　　金：JST CREST(Grant Nos.JPMJCR17I4,JPMJCR18I1,JPMJCR17I2,and JPMJCR18I3);JSPS KAKENHI(Grant No.JP20H02090)。

摘　　要：Since first establishing thermal measurement techniques for micrometer-scale wires,various methods have been devised and improved upon.However,the uncertainty of different measurements on the same sample has not yet been discussed.In this work,a round robin test was performed to compare the thermal conductivity and thermal diffusivity measurement methods for a fine metal wire.The tested material was a pure gold wire,with a diameter of 30μm.The wire was cut into certain lengths and distributed to four institutions using five different measurement methods:the direct current(DC)self-heating method,the DC heating T-type method,the 3ωmethod for thermal conductivity,the scanning laser heating alternating current(AC)method,and the spot periodic heating radiation thermometry method for thermal diffusivity.After completing the measurements,the reported thermal conductivity and thermal diffusivity at room temperature,i.e.,317 W·m^(-1)·K^(-1)and 128×10^(-6)m^(2)·s^(-1),respectively,were adopted as references for comparison with the measurement results.The advantages and disadvantages of each method are described in terms of the effect of electrical and thermal junctions fabricated on a wire,such as an electrode,a thermocouple,and a heat bath.The knowledge obtained from the tested methods will be useful for selecting and designing a measurement technique for various wire-like materials.

关 键 词：thermal conductivity thermal diffusivity round robin test microscale wire 

分 类 号：TG146.31[一般工业技术—材料科学与工程] TK124[金属学及工艺—金属材料]